Polyamide hot melt adhesive properties

Polyamide hot melt adhesive is based on polyamide resin. Polyamide resins are linear thermoplastic resins with many repeating amide groups in the molecular backbone. Compared with other thermoplastic resins, it has a notable feature that when it is heated and cooled, the melting and curing of the resin occur within a narrow temperature range. This feature allows polyamide hot-melt adhesives to be quickly cured by heat-coating after slight cooling after application; it can also maintain good adhesion performance at temperatures near the softening point.

Since the hydrogen on the amide group of the polyamide resin can bind strong hydrogen bonds with the electron donating carbonyl group on the segment of another amide group, the melting point of the resin is increased, thereby having good flexibility, oil resistance, and adhesiveness. Performance. These properties increase as the molecular weight of the resin increases. Compared with the ethylene-vinyl acetate copolymer hot melt adhesive, the polyamide hot melt adhesive has a higher softening point and therefore better heat resistance. The molecular weight of the polyamide resin currently used as a base of the hot melt adhesive is generally in the range of 1000-9000.

Source: Fine Chemical Network